QIANLI
Qianli 4 in 1 Magnetic Middle Layer BGA Reballing Platform for iPhone 16 Series
Qianli 4 in 1 Magnetic Middle Layer BGA Reballing Platform for iPhone 16 Series
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FREE Shipping
FREE SHIPPING on all orders. Fully Insured.
Handling time 1 - 3 working days. (PMC has to process your order and put all your items through its strict quality-control tests.)
Transit time 7 - 15 working days.
Get It Now, Pay Later
Get It Now, Pay Later
Pay using Mobicred. Simply choose Peach Payment >> Mobicred at checkout, and we’ll ship it once the order is approved.
Return Guarantee
Return Guarantee
For whatever reason if you are unsatisfied with your order within 7 days you can return it to us in new condition for a refund minus the shipping charges.
Payment & Security
Payment & Security
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Missing/Wrong Items Guarantee
Missing/Wrong Items Guarantee
If you receive a parcel with missing/incorrect/secondary packing items, please contact us within 7 days of delivery and provide the relevant proof. PMC will make compensation based on the damage situation.
2. To show the beauty of design in a compact shape, motherboard reballing without worry is compact and easy, saving space
3. Magnet sliding dislocation design, smart application of the sliding dislocation design, easy to take
4. CNC high-precision integrated processing, stable positioning for the motherboard, no deviation in reballing
5. Strong magnetic attraction, accurate positioning no offset, and encountering high-temperature magnetism will not weaken
6. High-temperature magnetic strong pressing prevents the stencils from bulging caused by high-temperature
7. Avoiding SIM card base not being tinned while the motherboard is tinned
8. Imported selection of high-quality steel material, manufactured under QianLi black stencils standard, wear resistance, ultra high toughness to support reballing
9. Square chamfer mesh, prevents the tin balls from being stuck in the mesh
10. Package includes:
1 x Reballing Platform
2 x Stencil